银钯导体浆料 传感器浆料 厚膜电路浆料产品规格书/Specification
产品/product: | 包封浆料/ package paste |
料号/part number: | 09L-4406 |
适用范围/Application:
该款浆料适合于电路、电阻片外封标识,外层包封,可用于玻璃、陶瓷、不锈钢、铝合金等基材
The paste is suitable for marking thick film circuit and outside package, glass, ceramic, metal, etc.
银钯导体浆料 传感器浆料 厚膜电路浆料使用条件/Operating conditions:
基材 Substrate | 厚膜电路、玻璃、陶瓷、金属等 thick film circuit, glass, ceramic, metal, etc. |
使用方法 Method of use | 印刷,200-250目 Printing, 200-250mesh |
流平 Levelling | 5-10min minutes at room temperature 室温下流平5-10分钟(时间根据流平的实际情况决定)。 |
通风烘箱烘烤150~200℃,20-30分钟 | |
固化 Curing conditions | (固化温度可以在150-200℃范围内,固化时间可根据实际情况决定) 150~200℃, 20-30 min ( It could be cured at a temperature between 150~ 200°C, but it depends of the thickness and the substrate.) |
稀释剂 Thinner | ST-1001 |
性能/Characteristics:
1.浆料性能/Paste Characteristics:
性能 Characteristic | 标准Standard | 测试方法及条件 Test method and conditions | |
1 | 细度 Fineness | ≤8μm | FOG test |
2 | 粘度 Viscosity | 80~150Pa.s | Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm,25±1℃, Brookfield HBT(博利飞)粘度计, 转子 SC4-14/6R), 10rpm,25±1℃ |
3 | Appearance 外观 | 白色,黑色,蓝色,绿色 white, black,blue, green |
2. 银钯导体浆料 传感器浆料 厚膜电路浆料烧结后特性/Characteristics aftercuring:
在 1 烧结条件下,Check fired film produced under the conditions specified in 1),
特性 Characteristics | Standard 标准 | 测试方法和条件 Test method and conditions | |
4 | Acid resistance 耐酸性 | Fine |
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